DocumentCode
2169330
Title
DC-to-20 GHz Metal-to-Metal Contact Flip Chip Assembly Shunt MEMS Switch
Author
Yassini, Bahram ; Zybura, Andre ; Choi, Savio ; Yu, Ming
Author_Institution
COM DEV Ltd, 155 Sheldon Drive, Cambridge, Ontario, N1R 7H6, Canada
fYear
2002
fDate
23-26 Sept. 2002
Firstpage
1
Lastpage
3
Abstract
A novel flip chip assembly MEMS shunt switch is reported. The MEMS device is flip chip attached on a microstrip circuit with Alumina substrate and released. A first electro-static actuated metal-to-metal contact shunt switch using flip chip process is produced with excellent RF performance.
Keywords
Assembly; Circuits; Contacts; Flip chip; Microelectromechanical devices; Micromechanical devices; Microstrip; Microswitches; Radio frequency; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2002. 32nd European
Conference_Location
Milan, Italy
Type
conf
DOI
10.1109/EUMA.2002.339239
Filename
4140319
Link To Document