Title :
BiCS Flash as a Future 3D Non-Volatile Memory Technology for Ultra High Density Storage Devices
Author_Institution :
Center for Semicond. Res. & Dev., Toshiba Corp., Yokohama
Abstract :
In this presentation, recent reports on three dimensional non-volatile memories are reviewed and their pros and cons are discussed. BiCS (Bit Cost Scalable) flash technology is focused as one of the most promising candidates for the future ultra high density storage devices.
Keywords :
flash memories; 3D nonvolatile memory technology; BiCS flash; bit cost scalable flash technology; ultra high density storage device; Nonvolatile memory;
Conference_Titel :
Memory Workshop, 2009. IMW '09. IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-3762-7
DOI :
10.1109/IMW.2009.5090581
