• DocumentCode
    2169626
  • Title

    Effect of plating stubs of BGA packages on spurious EM radiation

  • Author

    Yue, Heping ; Lamson, Michael

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    786
  • Lastpage
    792
  • Abstract
    A one-metal layer Micro Star BGA package was used for the analysis of spurious EM radiation characteristics of the package conductors. These conductors were modeled as monopole antennas with an FDTD simulation tool. The effect of plating stubs of the package leads on radiation characteristics was investigated by S-parameter measurements. It was observed that the length and shape of plating stubs will affect the magnitude and frequency of the resultant radiation. However, the effect is negligible in the frequency range of current digital ICs. Based on the theoretical analysis of EMI sources, power spectrum analysis and SPICE simulation, a design idea of constructing the package built-in low pass LC filter was proposed, which makes use of the parasitic inductance and capacitance of the package leads to filter off high frequency harmonics that are sources of EM radiation from the digital signal path between IC chip and PC board
  • Keywords
    S-parameters; SPICE; ball grid arrays; electromagnetic interference; finite difference time-domain analysis; integrated circuit packaging; low-pass filters; EMI; FDTD simulation; Micro Star BGA package; S-parameter measurement; SPICE; built-in low-pass LC filter; digital IC; full-wave model; monopole antenna; plating stub; power spectrum analysis; spurious EM radiation; Conductors; Digital filters; Electromagnetic radiation; Finite difference methods; Frequency; Harmonic analysis; Integrated circuit packaging; Power harmonic filters; Signal analysis; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853249
  • Filename
    853249