• DocumentCode
    2169634
  • Title

    Interconnect and cell redundancy tradeoffs for WSI: an FFT case study

  • Author

    Landis, David ; Nienhaus, Harry ; Nigam, Nitin

  • Author_Institution
    Univ. of South Florida, Tampa, FL, USA
  • fYear
    1991
  • fDate
    29-31 Jan 1991
  • Firstpage
    314
  • Lastpage
    320
  • Abstract
    The authors describe the results of an investigation into the relationship between cell redundancy, yield, and interconnect area for WSI (wafer scale integration) designs. A general analysis framework is presented which allows algorithmic computation of the optimum amount of redundancy from an area efficiency standpoint. The results of this theoretical study were applied to the case study of an 8-point FFT (fast Fourier transform) WSI design which uses a novel architecture requiring only two functional cell types. The optimum design point and predicted cell yield are identified for this case study
  • Keywords
    VLSI; fast Fourier transforms; fault tolerant computing; microprocessor chips; multiprocessing systems; redundancy; systolic arrays; FFT case study; WSI; algorithmic computation; area efficiency; case study; cell redundancy tradeoffs; interconnect area; interconnect redundancy tradeoff; optimum amount of redundancy; optimum design point; predicted cell yield; theoretical study; wafer scale integration; yield; Computer aided software engineering; Integrated circuit interconnections; Integrated circuit yield; LAN interconnection; Manufacturing processes; Microelectronics; Monolithic integrated circuits; Redundancy; Silicon; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-9126-3
  • Type

    conf

  • DOI
    10.1109/ICWSI.1991.151733
  • Filename
    151733