DocumentCode :
2169634
Title :
Interconnect and cell redundancy tradeoffs for WSI: an FFT case study
Author :
Landis, David ; Nienhaus, Harry ; Nigam, Nitin
Author_Institution :
Univ. of South Florida, Tampa, FL, USA
fYear :
1991
fDate :
29-31 Jan 1991
Firstpage :
314
Lastpage :
320
Abstract :
The authors describe the results of an investigation into the relationship between cell redundancy, yield, and interconnect area for WSI (wafer scale integration) designs. A general analysis framework is presented which allows algorithmic computation of the optimum amount of redundancy from an area efficiency standpoint. The results of this theoretical study were applied to the case study of an 8-point FFT (fast Fourier transform) WSI design which uses a novel architecture requiring only two functional cell types. The optimum design point and predicted cell yield are identified for this case study
Keywords :
VLSI; fast Fourier transforms; fault tolerant computing; microprocessor chips; multiprocessing systems; redundancy; systolic arrays; FFT case study; WSI; algorithmic computation; area efficiency; case study; cell redundancy tradeoffs; interconnect area; interconnect redundancy tradeoff; optimum amount of redundancy; optimum design point; predicted cell yield; theoretical study; wafer scale integration; yield; Computer aided software engineering; Integrated circuit interconnections; Integrated circuit yield; LAN interconnection; Manufacturing processes; Microelectronics; Monolithic integrated circuits; Redundancy; Silicon; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9126-3
Type :
conf
DOI :
10.1109/ICWSI.1991.151733
Filename :
151733
Link To Document :
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