DocumentCode
2169634
Title
Interconnect and cell redundancy tradeoffs for WSI: an FFT case study
Author
Landis, David ; Nienhaus, Harry ; Nigam, Nitin
Author_Institution
Univ. of South Florida, Tampa, FL, USA
fYear
1991
fDate
29-31 Jan 1991
Firstpage
314
Lastpage
320
Abstract
The authors describe the results of an investigation into the relationship between cell redundancy, yield, and interconnect area for WSI (wafer scale integration) designs. A general analysis framework is presented which allows algorithmic computation of the optimum amount of redundancy from an area efficiency standpoint. The results of this theoretical study were applied to the case study of an 8-point FFT (fast Fourier transform) WSI design which uses a novel architecture requiring only two functional cell types. The optimum design point and predicted cell yield are identified for this case study
Keywords
VLSI; fast Fourier transforms; fault tolerant computing; microprocessor chips; multiprocessing systems; redundancy; systolic arrays; FFT case study; WSI; algorithmic computation; area efficiency; case study; cell redundancy tradeoffs; interconnect area; interconnect redundancy tradeoff; optimum amount of redundancy; optimum design point; predicted cell yield; theoretical study; wafer scale integration; yield; Computer aided software engineering; Integrated circuit interconnections; Integrated circuit yield; LAN interconnection; Manufacturing processes; Microelectronics; Monolithic integrated circuits; Redundancy; Silicon; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-8186-9126-3
Type
conf
DOI
10.1109/ICWSI.1991.151733
Filename
151733
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