• DocumentCode
    2169673
  • Title

    Temperature-based phase change memory model for pulsing scheme assessment

  • Author

    Liao, Yi-Bo ; Lin, Jun-Tin ; Chiang, Meng-Hsueh

  • Author_Institution
    Dept. of Electron. Eng., Nat. Ilan Univ., Ilan
  • fYear
    2008
  • fDate
    2-4 June 2008
  • Firstpage
    199
  • Lastpage
    202
  • Abstract
    A physical yet analytical phase change memory (PCM) model simultaneously accounting for thermal and electrical conductivities is presented. Due to the physics based nature of the model, the essential temperature from heating and cooling of PCM during operation is instantaneously updated. More importantly, the model can be applied to non-conventional circuit design technique. We show that for the first time the input current pulsing scheme for PCM programming can be significantly simplified via the unique intrinsic thermal memory effect. The model is implemented in HSPICE using Verilog-A, which is flexible and portable for different circuit simulators. As PCM technology is emerging, the predictive compact model can expedite the novel technology development.
  • Keywords
    SPICE; electrical conductivity; phase change materials; semiconductor storage; thermal conductivity; HSPICE; PCM model; Verilog-A; electrical conductivities; input current pulsing scheme; intrinsic thermal memory effect; nonconventional circuit design technique; phase change memory model; pulsing scheme assessment; thermal conductivities; Circuit synthesis; Cooling; Flexible printed circuits; Hardware design languages; Heating; Phase change materials; Phase change memory; Physics; Temperature; Thermal conductivity; Phase change memory (PCM); SPICE; Verilog-A; compact model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-1810-7
  • Electronic_ISBN
    978-1-4244-1811-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2008.4567278
  • Filename
    4567278