DocumentCode
2169707
Title
Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab
Author
Tilmans, H.A.C. ; Ziad, H. ; Jansen, H. ; Di Monaco, O. ; Jourdain, A. ; De Raedt, W. ; Rottenberg, X. ; De Backer, E. ; Decaussernaeker, A. ; Baert, K.
fYear
2001
fDate
2-5 Dec. 2001
Abstract
Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as the bonding and sealing material. Measurements show that the influence of the wafer-level package on the RF performance can be made very small.
Keywords
UHF devices; microactuators; micromachining; seals (stoppers); semiconductor device packaging; CMOS fab; RF-MEMS switches; benzocyclobutene; bonding material; metal surface micromachining process; on-chip sealed cavities; sealing; wafer-level packaging scheme; Bridge circuits; Capacitance; Communication switching; Coplanar waveguides; Packaging; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Voltage; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-7050-3
Type
conf
DOI
10.1109/IEDM.2001.979663
Filename
979663
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