Title :
Integration of SAW filters
Author :
Hdiji, Tarak ; Mnif, Hassene ; Loulou, Mourad
Author_Institution :
LETI, Electron. & Inf. Technol. Lab., Nat. Eng. Sch. of Sfax, Sfax
Abstract :
Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important properties such as, high acoustic velocities, power durability and temperature stability. Simulation results are presented for different design of SAW filter and different piezoelectric substrates.
Keywords :
CMOS integrated circuits; intelligent materials; micromachining; piezoelectric materials; surface acoustic wave filters; CMOS circuitry; IC scale substrate; SAW device; SAW filters; acoustic velocities; micromachining technology; monolithic fabrication; monolithic integrated circuit; piezoelectric materials; piezoelectric substrates; power durability; smart materials; surface acoustic wave devices; temperature stability; Acoustic waves; CMOS integrated circuits; CMOS technology; Fabrication; Micromachining; Microwave integrated circuits; Monolithic integrated circuits; SAW filters; Surface acoustic wave devices; Surface acoustic waves; Micromachining; Monolithic IC; SAW; Smart materials;
Conference_Titel :
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-1810-7
Electronic_ISBN :
978-1-4244-1811-4
DOI :
10.1109/ICICDT.2008.4567287
