DocumentCode
2170316
Title
Study on Characteristics of Interface Between Multiple Laminar Streams and Application for Secondary Etching Inside Microchannels
Author
Haibo, Xie ; Yi, Zheng ; Xin, Fu ; Huayong, Yang ; Hongyang, Du
Author_Institution
State Key Lab. of Fluid Power Transm. & Control, Zhejiang Univ., Hangzhou
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
243
Lastpage
248
Abstract
Typical microfluidc devices basically operate at low Reynolds numbers. The flowage in microchannels is entirely laminar. This letter quantifies both experimentally and numerically the diffusion across the interface between two aqueous solutions in pressure-driven laminar flow in microchannels. The relationship between the flow parameters at the inlets and the interface´s location and diffusion extent is verified at high Peclet number (about 800~8000). The experimental results accord with the CFD results very well. A quantitative conclusion of the interface location and the diffusion extent between two streams near the walls, such as described in this letter, are required for the further development of the technology of microfabrication inside microchannels using fluid flow. The features of the micro structures, which are patterned with this fabrication method, are determined by interface location and the diffusion across the interface in a great degree. In the last part of this letter we give some the experiment results about the relationship of the flow parameters and the topography of the secondary patterned micro structures.
Keywords
computational fluid dynamics; etching; laminar flow; microchannel flow; microfabrication; CFD; Peclet number; Reynolds numbers; computational fluid dynamics; fluid flow; microchannels; microfabrication; microfluidc devices; multiple laminar streams; secondary etching; Computational fluid dynamics; Fabrication; Fluid flow; Glass; Microchannel; Microelectrodes; Microfluidics; Solid modeling; Surface topography; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechtronic and Embedded Systems and Applications, 2008. MESA 2008. IEEE/ASME International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2367-5
Electronic_ISBN
978-1-4244-2368-2
Type
conf
DOI
10.1109/MESA.2008.4735750
Filename
4735750
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