• DocumentCode
    2170474
  • Title

    A Remote Software/Hardware Co-simulation Platform for SoC Design

  • Author

    Wu, Shihong ; Ling, Xiang ; Li, Zhongqi ; Yue, Yang

  • Author_Institution
    Nat. Commun. Lab., Univ. of Electron. Sci. & Technol. of China, Chengdu
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    534
  • Lastpage
    539
  • Abstract
    As an efficient technique to accelerate system-on-chip (SoC) design, software/hardware co-simulation gives a flexible method to simulate hardware and software simultaneously and save the time-to-market. In this paper, a platform of software/hardware co-simulation is implemented, which utilize a debugger to interconnect the server and the design under test (DUT) on remote FPGA board via Internet. The software environment and hardware environment are run on the server and remote FPGA board respectively. The debugger establishes a real-time bidirectional data path between them and performs the data conversion. The embedded interface module can be synthesized with user´s DUT smoothly. This platform takes full advantage of software´s flexibility and hardware´s high speed, supports remote operation and various types of co-simulation modes, while consumes few hardware resource.
  • Keywords
    digital simulation; field programmable gate arrays; hardware-software codesign; software engineering; system-on-chip; FPGA; Internet; SoC design; data conversion; design under test; hardware environment; real-time bidirectional data path; software environment; software-hardware cosimulation platform; system-on-chip; time-to-market; Acceleration; Field programmable gate arrays; Hardware; Software debugging; Software design; Software systems; Software testing; System-on-a-chip; Time to market; Web server; SoC; Software/Hardware Co-simulation; VLSI; simulation platform;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechtronic and Embedded Systems and Applications, 2008. MESA 2008. IEEE/ASME International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2367-5
  • Electronic_ISBN
    978-1-4244-2368-2
  • Type

    conf

  • DOI
    10.1109/MESA.2008.4735756
  • Filename
    4735756