DocumentCode
2170588
Title
Epoxy adhesives for optical element attachment in planar passive optical components
Author
Liu, Jay G. ; Andersen, Bo Moller ; Bergmann, Ernest E. ; Fairchild, Stephen K.
Author_Institution
Optoelectron. Center, Lucent Technol., Breinigsville, PA, USA
fYear
2000
fDate
2000
Firstpage
975
Lastpage
980
Abstract
Optical elements are bonded to the planar housing with adhesive materials for applications in a non-hermetic package of integrated passive optical devices. Eight epoxy adhesives have been evaluated in order to select the most suitable adhesive for use in a high-speed, automated assembly production facility. Tests were performed to examine the angular alignment accuracy and to determine the long-term adhesion and stability of the epoxy bonded components. Our results show that a thixotropic epoxy having high green strength, minimal shrinkage on cure, low outgassing and high resistance to humidity environment is suitable for bonding optical elements for the application
Keywords
adhesives; integrated optics; packaging; polymers; thixotropy; automated assembly; epoxy adhesive; integrated passive optical component; nonhermetic package; optical element attachment; planar housing; thixotropy; Assembly; Bonding; High speed optical techniques; Integrated optics; Optical devices; Optical materials; Packaging; Performance evaluation; Production facilities; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853286
Filename
853286
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