DocumentCode :
2170588
Title :
Epoxy adhesives for optical element attachment in planar passive optical components
Author :
Liu, Jay G. ; Andersen, Bo Moller ; Bergmann, Ernest E. ; Fairchild, Stephen K.
Author_Institution :
Optoelectron. Center, Lucent Technol., Breinigsville, PA, USA
fYear :
2000
fDate :
2000
Firstpage :
975
Lastpage :
980
Abstract :
Optical elements are bonded to the planar housing with adhesive materials for applications in a non-hermetic package of integrated passive optical devices. Eight epoxy adhesives have been evaluated in order to select the most suitable adhesive for use in a high-speed, automated assembly production facility. Tests were performed to examine the angular alignment accuracy and to determine the long-term adhesion and stability of the epoxy bonded components. Our results show that a thixotropic epoxy having high green strength, minimal shrinkage on cure, low outgassing and high resistance to humidity environment is suitable for bonding optical elements for the application
Keywords :
adhesives; integrated optics; packaging; polymers; thixotropy; automated assembly; epoxy adhesive; integrated passive optical component; nonhermetic package; optical element attachment; planar housing; thixotropy; Assembly; Bonding; High speed optical techniques; Integrated optics; Optical devices; Optical materials; Packaging; Performance evaluation; Production facilities; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853286
Filename :
853286
Link To Document :
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