• DocumentCode
    2170588
  • Title

    Epoxy adhesives for optical element attachment in planar passive optical components

  • Author

    Liu, Jay G. ; Andersen, Bo Moller ; Bergmann, Ernest E. ; Fairchild, Stephen K.

  • Author_Institution
    Optoelectron. Center, Lucent Technol., Breinigsville, PA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    975
  • Lastpage
    980
  • Abstract
    Optical elements are bonded to the planar housing with adhesive materials for applications in a non-hermetic package of integrated passive optical devices. Eight epoxy adhesives have been evaluated in order to select the most suitable adhesive for use in a high-speed, automated assembly production facility. Tests were performed to examine the angular alignment accuracy and to determine the long-term adhesion and stability of the epoxy bonded components. Our results show that a thixotropic epoxy having high green strength, minimal shrinkage on cure, low outgassing and high resistance to humidity environment is suitable for bonding optical elements for the application
  • Keywords
    adhesives; integrated optics; packaging; polymers; thixotropy; automated assembly; epoxy adhesive; integrated passive optical component; nonhermetic package; optical element attachment; planar housing; thixotropy; Assembly; Bonding; High speed optical techniques; Integrated optics; Optical devices; Optical materials; Packaging; Performance evaluation; Production facilities; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853286
  • Filename
    853286