Title :
Table of contents
Abstract :
The following topics are dealt with: system integration; integrated circuit interconnections; dielectric materials; reliability and metallization
Keywords :
dielectric materials; integrated circuit interconnections; metallisation; nanotechnology; reliability; dielectric materials; integrated circuit interconnections; metallization; reliability; system integration;
Conference_Titel :
Interconnect Technology Conference, 2006 International
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-0104-6
DOI :
10.1109/IITC.2006.1648627
