DocumentCode
2170712
Title
Table of contents
fYear
2006
fDate
5-7 June 2006
Abstract
The following topics are dealt with: system integration; integrated circuit interconnections; dielectric materials; reliability and metallization
Keywords
dielectric materials; integrated circuit interconnections; metallisation; nanotechnology; reliability; dielectric materials; integrated circuit interconnections; metallization; reliability; system integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2006 International
Conference_Location
Burlingame, CA
Print_ISBN
1-4244-0104-6
Type
conf
DOI
10.1109/IITC.2006.1648627
Filename
1648627
Link To Document