Author :
Tan, J.B. ; Zhang, B.C. ; Tang, T.J. ; Perera, C. ; Lim, Y.K. ; Siew, Y.K. ; Ee, Y.C. ; Lu, W. ; Liu, H. ; Seet, C.S. ; Zhang, H. ; Lim, S.K. ; Chua, S.T. ; Ismail, Z. ; Seah, B.M. ; Ee, P.Y. ; Vigar, D. ; Hsia, L.C.
Abstract :
This paper analyses a few key yield and reliability challenges of the back-end-of-line (BEOL) interconnects. A discussion of the failure modes and mechanisms are elaborated on challenges arising from weak patterning, missing trench and plasma charging effect. Enhancement of via and bond pad reliability are also discussed
Keywords :
failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit yield; back-end-of-line interconnects; bond pad reliability; failure modes; interconnect yield; missing trench; plasma charging effect; via reliability; weak patterning; Bonding; Copper; Etching; Manufacturing industries; Merging; Packaging; Plasma applications; Pulp manufacturing; Resists; Semiconductor device manufacture;
