Title :
Understanding integration damage to low-k films: mechanisms and dielectric behaviour at 100kHz and 4GHz
Author :
Iacopi, F. ; Richard, O. ; Van Aelst, J. ; Mannaert, G. ; Talanov, V.V. ; Scherz, A. ; Schwartz, A.R. ; Bender, H. ; Travaly, Y. ; Brongersma, S.H. ; Antonelli, G.A. ; Moinpour, M. ; Beyer, G.
Author_Institution :
IMEC, Leuven
Abstract :
Novel in-line characterization techniques such as SAWs and a near-field microwave probe are combined to more widely studied physical and electrical off-line methodologies for the evaluation of dielectric damage. Physical characterization of the damage with EFTEM and SAWs and capacitance evaluation at 100kHz and 4GHz point out the presence of different types of low-k damage depending on the chosen patterning processes. Besides damage location (top or sidewall), the distinction between damage with and without densification is extremely important in terms of recovery and dielectric response at low and high frequency
Keywords :
integrated circuit interconnections; low-k dielectric thin films; 100 kHz; 4 GHz; EFTEM; SAW technique; capacitance evaluation; damage location; dielectric behaviour; dielectric damage; low k films; near-field microwave probe; patterning processes; Acoustic measurements; Ash; Capacitance measurement; Dielectric films; Dielectric materials; Etching; Frequency; Metallization; Probes; Sawing machines;
Conference_Titel :
Interconnect Technology Conference, 2006 International
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-0104-6
DOI :
10.1109/IITC.2006.1648632
