DocumentCode :
2170965
Title :
Finite element modeling of BGA packages for life prediction
Author :
Gustafsson, G. ; Guven, I. ; Kradinov, V. ; Madenci, E.
Author_Institution :
Ericsson Components AB, Stockholm, Sweden
fYear :
2000
fDate :
2000
Firstpage :
1059
Lastpage :
1063
Abstract :
The life-prediction analysis of an electronic package requires a sequence of critical assumptions concerning the finite element models, such as the slice model and a global model with or without a submodel. Although specifics of such analyses are available in the literature, a comparison among themselves against the same electronic package with measured life cycles does not exist. This study addresses the questions arising during the life-prediction analysis by considering two particular packages with different geometric and material compositions. Solder joint reliability analyses for each of the packages are performed by constructing the following commonly accepted finite element models: (1) nonlinear slice model, (2) nonlinear global model with linear super elements, (3) linear global model with nonlinear submodel, (4) nonlinear global model with a nonlinear submodel, and (5) nonlinear global model. In the global analysis with a submodel, the displacement fields obtained from the global analysis are extrapolated for different temperatures and applied as boundary conditions in the submodel of the solder joint with a refined mesh. In the nonlinear analysis, four thermal cycles are sufficient to achieve a stable hysteresis loop. The volume-weighted plastic work density and the characteristic life are calculated in all cases. The life predictions based on widely accepted Darveaux empirical constants are compared to experimental measurements. This study helps to identify the effects of certain modeling assumptions on characteristic life predictions
Keywords :
ball grid arrays; fatigue; finite element analysis; soldering; ball grid array; electronic package; fatigue life; finite element model; global model; slice model; solder joint; submodel; Boundary conditions; Composite materials; Electronics packaging; Finite element methods; Hysteresis; Performance analysis; Plastics; Predictive models; Soldering; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853300
Filename :
853300
Link To Document :
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