DocumentCode :
2171053
Title :
FEA simulation on moisture absorption in PBGA packages under various moisture pre-conditioning
Author :
Fai, Lam Tim
Author_Institution :
DA Lab., Adv. Micro Devices (Singapore) PTE Ltd., Singapore
fYear :
2000
fDate :
2000
Firstpage :
1078
Lastpage :
1082
Abstract :
FEA (Finite Element Analysis) simulation was carried out to study the moisture absorption behavior in plastic BGA packages under various moisture pre-conditioning. The modeling details are presented and some typical results in moisture concentrations and weight gain are illustrated
Keywords :
ball grid arrays; environmental degradation; finite element analysis; moisture; plastic packaging; PBGA package; finite element model; moisture absorption; moisture pre-conditioning; numerical simulation; Absorption; Analytical models; Assembly; Condition monitoring; Copper; Finite element methods; Gain measurement; Moisture; Plastic packaging; Plastics industry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853303
Filename :
853303
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2171053
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