DocumentCode
2171053
Title
FEA simulation on moisture absorption in PBGA packages under various moisture pre-conditioning
Author
Fai, Lam Tim
Author_Institution
DA Lab., Adv. Micro Devices (Singapore) PTE Ltd., Singapore
fYear
2000
fDate
2000
Firstpage
1078
Lastpage
1082
Abstract
FEA (Finite Element Analysis) simulation was carried out to study the moisture absorption behavior in plastic BGA packages under various moisture pre-conditioning. The modeling details are presented and some typical results in moisture concentrations and weight gain are illustrated
Keywords
ball grid arrays; environmental degradation; finite element analysis; moisture; plastic packaging; PBGA package; finite element model; moisture absorption; moisture pre-conditioning; numerical simulation; Absorption; Analytical models; Assembly; Condition monitoring; Copper; Finite element methods; Gain measurement; Moisture; Plastic packaging; Plastics industry;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853303
Filename
853303
Link To Document