Title :
A New Global Interconnect Paradigm: MIM Power-Ground Plane Capacitors
Author :
Sekar, Deepak C. ; Demaray, Ernest ; Zhang, Hongmei ; Kohl, Paul A. ; Meindl, James D.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA
Abstract :
Based on scaling trends observed with a model for global interconnect pitch, a new paradigm is introduced for ASICs in which power and ground planes separated by a high k dielectric are placed on-chip. This gives a 4times reduction in on-chip IR drop, reduces di/dt noise due to package inductance by 2.6times without using any transistor area for decoupling capacitors (decaps), improves clock wire latency by 5%, reduces delay of global signal wires by 23% and decreases energy per bit for global signal wires by 22%. Thus, global interconnect problems could be substantially alleviated
Keywords :
MIM devices; application specific integrated circuits; high-k dielectric thin films; integrated circuit interconnections; integrated circuit packaging; thin film capacitors; ASIC; MIM power-ground plane capacitors; clock wire latency improvement; decoupling capacitors; global interconnect paradigm; global signal delay reduction; high k dielectrics; Application specific integrated circuits; Capacitance; Clocks; Delay; MIM capacitors; Multiprocessor interconnection networks; Packaging; Power grids; Wire; Wiring;
Conference_Titel :
Interconnect Technology Conference, 2006 International
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-0104-6
DOI :
10.1109/IITC.2006.1648643
