• DocumentCode
    2171508
  • Title

    SMT connectors for removable small-form-factor transceiver modules

  • Author

    Hogan, William K. ; Gaio, David P. ; Branch, S.M.

  • Author_Institution
    IBM Corp., Rochester, MN, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1164
  • Lastpage
    1172
  • Abstract
    A small-form-factor (SFF) surface-mounted optoelectronic connector system that accommodates hot-pluggable, removable, SFF transceiver modules is discussed. This new system eliminates the need for PTH soldering. The novel surface-mount connector and the associated Z-axis removable transceiver each have 20 electrical contacts. Connector electrical performance exceeding 10 Gb/s has been demonstrated, yet the connector system allows design of transceivers that meet the SFF size constraints. Technical details associated with the development of the surface-mount-technology (SMT) connector are discussed. This includes connector selection criteria, guide rail and cam system design, materials, design for low cost automation, electrical performance, and mechanical performance. The SMT connector and transceiver were designed to meet thermal, electromagnetic interference, human factors, mechanical, electrical, and manufacturing requirements. These system requirements, design tradeoffs, technical solutions, and issues are discussed
  • Keywords
    electromagnetic interference; modules; optical couplers; optoelectronic devices; surface mount technology; transceivers; SMT connectors; Z-axis removable transceiver; cam system design; connector selection criteria; design tradeoffs; electrical performance; electromagnetic interference; guide rail; hot-pluggable modules; human factors; low cost automation; mechanical performance; optoelectronic connector system; removable small-form-factor transceiver modules; system requirements; technical solutions; Connectors; Contacts; Costs; Design automation; Interference constraints; Manufacturing automation; Rails; Soldering; Surface-mount technology; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853320
  • Filename
    853320