Title :
Evaluation and Numerical Simulation of Optimal Structural Designs for Reliable Packaging of Ultra Low K Process Technology
Author :
Huang, T.C. ; Peng, C.T. ; Yao, C.H. ; Huang, C.H. ; Li, S.Y. ; Liang, M.S. ; Wang, Y.C. ; Wan, W.K. ; Lin, K.C. ; Hsia, Chin C. ; Liang, Mong-Song
Author_Institution :
Adv. Module Technol. Div., Taiwan Semicond. Manuf. Co., Ltd., Hsin-Chu
Abstract :
The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically reinforced structure units are demonstrated essential. It is also shown that FEA help extract useful structural design concepts for CUP. The Poisson effects leading to a dual-ring-shaped high stress distribution area are confirmed to be detrimental for wire bonding and wire-pull tests. Excellent agreements are obtained as compared with the experimental data
Keywords :
CAD; electronic engineering computing; finite element analysis; integrated circuit packaging; lead bonding; low-k dielectric thin films; reliability; seals (stoppers); 3D finite element analysis; Poisson effects; circuit under fad; die edge-seals; packaging reliability; ultra low k process technology; wire bonding; wire-pull tests; Data mining; Energy states; Finite element methods; Integrated circuit interconnections; Manufacturing industries; Numerical simulation; Semiconductor device manufacture; Semiconductor device packaging; Stress; Wire;
Conference_Titel :
Interconnect Technology Conference, 2006 International
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-0104-6
DOI :
10.1109/IITC.2006.1648655
