DocumentCode
2171526
Title
A redesign methodology for Reverse Engineering integrated with haptic modeling
Author
Cheng, Siyuan ; Yang, Xuerong ; Zhang, Xiangwei ; Liang, Shiquan
Author_Institution
Fac. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China
Volume
3
fYear
2010
fDate
26-28 Feb. 2010
Firstpage
105
Lastpage
108
Abstract
Product redesign has been the main focus of Reverse Engineering (RE), especially for freeform shapes. Research in product redesign has led to the development of some interactive and intuitive deformation methods for freeform curves and surfaces modification with traditional two-dimensional based human-computer interfaces. Haptic interface provides new ways for human to interact with objects in virtual world. In this paper, we propose a new redesign methodology for reverse engineering integrated with haptic modeling, which can fuse its intuitive and flexibility of haptic modeling into smoothness and precision of parametric RE.
Keywords
haptic interfaces; human computer interaction; product design; reverse engineering; freeform curves; freeform shapes; haptic interface; haptic modeling; product redesign; reverse engineering; surface modification; two-dimensional based human computer interfaces; virtual world; Deformable models; Design engineering; Haptic interfaces; Humans; Product design; Reverse engineering; Shape control; Spline; Surface reconstruction; Surface topography; Haptic modelling; Redesign; Reverse engineering; Surface deformation;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer and Automation Engineering (ICCAE), 2010 The 2nd International Conference on
Conference_Location
Singapore
Print_ISBN
978-1-4244-5585-0
Electronic_ISBN
978-1-4244-5586-7
Type
conf
DOI
10.1109/ICCAE.2010.5452050
Filename
5452050
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