• DocumentCode
    2171526
  • Title

    A redesign methodology for Reverse Engineering integrated with haptic modeling

  • Author

    Cheng, Siyuan ; Yang, Xuerong ; Zhang, Xiangwei ; Liang, Shiquan

  • Author_Institution
    Fac. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • Volume
    3
  • fYear
    2010
  • fDate
    26-28 Feb. 2010
  • Firstpage
    105
  • Lastpage
    108
  • Abstract
    Product redesign has been the main focus of Reverse Engineering (RE), especially for freeform shapes. Research in product redesign has led to the development of some interactive and intuitive deformation methods for freeform curves and surfaces modification with traditional two-dimensional based human-computer interfaces. Haptic interface provides new ways for human to interact with objects in virtual world. In this paper, we propose a new redesign methodology for reverse engineering integrated with haptic modeling, which can fuse its intuitive and flexibility of haptic modeling into smoothness and precision of parametric RE.
  • Keywords
    haptic interfaces; human computer interaction; product design; reverse engineering; freeform curves; freeform shapes; haptic interface; haptic modeling; product redesign; reverse engineering; surface modification; two-dimensional based human computer interfaces; virtual world; Deformable models; Design engineering; Haptic interfaces; Humans; Product design; Reverse engineering; Shape control; Spline; Surface reconstruction; Surface topography; Haptic modelling; Redesign; Reverse engineering; Surface deformation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer and Automation Engineering (ICCAE), 2010 The 2nd International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-5585-0
  • Electronic_ISBN
    978-1-4244-5586-7
  • Type

    conf

  • DOI
    10.1109/ICCAE.2010.5452050
  • Filename
    5452050