Title :
A redesign methodology for Reverse Engineering integrated with haptic modeling
Author :
Cheng, Siyuan ; Yang, Xuerong ; Zhang, Xiangwei ; Liang, Shiquan
Author_Institution :
Fac. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China
Abstract :
Product redesign has been the main focus of Reverse Engineering (RE), especially for freeform shapes. Research in product redesign has led to the development of some interactive and intuitive deformation methods for freeform curves and surfaces modification with traditional two-dimensional based human-computer interfaces. Haptic interface provides new ways for human to interact with objects in virtual world. In this paper, we propose a new redesign methodology for reverse engineering integrated with haptic modeling, which can fuse its intuitive and flexibility of haptic modeling into smoothness and precision of parametric RE.
Keywords :
haptic interfaces; human computer interaction; product design; reverse engineering; freeform curves; freeform shapes; haptic interface; haptic modeling; product redesign; reverse engineering; surface modification; two-dimensional based human computer interfaces; virtual world; Deformable models; Design engineering; Haptic interfaces; Humans; Product design; Reverse engineering; Shape control; Spline; Surface reconstruction; Surface topography; Haptic modelling; Redesign; Reverse engineering; Surface deformation;
Conference_Titel :
Computer and Automation Engineering (ICCAE), 2010 The 2nd International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5585-0
Electronic_ISBN :
978-1-4244-5586-7
DOI :
10.1109/ICCAE.2010.5452050