Author_Institution :
Sematech/AMD, Austin, TX, USA
Abstract :
Historically, body ties have been designed using removal of DC floating-body (FB) effects (e.g., kink, breakdown voltage) as the main criteria. It has been implicitly assumed that the transient FB effects would be minimized too with such a tie. However, such body ties while “suppressing” DC effects, may not necessarily be effective in AC/transient conditions, since the body (dis)charging time constants may be much larger than desired. For example, in a digital SOI CMOS circuit, with the gate switching at a few tens of ps, the efficacy of the body tie may be little or none at all, depending on the response time τB(=RBCB) of the body. Hence, in order to design effective body ties in transients, dynamic (dis)charging effects due to RB and CB in the body must be included
Keywords :
CMOS digital integrated circuits; silicon-on-insulator; transient analysis; body ties; digital circuit; dynamic switching; partially depleted SOI CMOS technology; transient floating-body effects; Board of Directors; CMOS digital integrated circuits; CMOS technology; DC generators; Equivalent circuits; Hysteresis; Immune system; Switching circuits; Thermal resistance; Voltage;