DocumentCode
2171756
Title
Reliability of flip chip BGA package on organic substrate
Author
Ahn, Eun-Chul ; Cho, Tae-je ; Jong-Bo Shin ; Moon, Ho-Joong ; Lyu, Ju-Hyun ; Choi, Ki-Won ; Kang, Sa-Yoon ; Oh, Se-Yong
Author_Institution
Package Dev. Team, Samsung Electron. Co. Ltd., Chungnam, South Korea
fYear
2000
fDate
2000
Firstpage
1215
Lastpage
1220
Abstract
In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures
Keywords
ball grid arrays; flip-chip devices; integrated circuit packaging; integrated circuit reliability; bump joint; die cracking; failure mode; flip-chip BGA package; organic substrate; reliability; solder ball joint; underfill cracking; Bonding; Electronic packaging thermal management; Electronics packaging; Flip chip; Moon; Random access memory; Testing; Thermal stresses; Vehicles; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853328
Filename
853328
Link To Document