Title :
Reliability of flip chip BGA package on organic substrate
Author :
Ahn, Eun-Chul ; Cho, Tae-je ; Jong-Bo Shin ; Moon, Ho-Joong ; Lyu, Ju-Hyun ; Choi, Ki-Won ; Kang, Sa-Yoon ; Oh, Se-Yong
Author_Institution :
Package Dev. Team, Samsung Electron. Co. Ltd., Chungnam, South Korea
Abstract :
In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures
Keywords :
ball grid arrays; flip-chip devices; integrated circuit packaging; integrated circuit reliability; bump joint; die cracking; failure mode; flip-chip BGA package; organic substrate; reliability; solder ball joint; underfill cracking; Bonding; Electronic packaging thermal management; Electronics packaging; Flip chip; Moon; Random access memory; Testing; Thermal stresses; Vehicles; Wire;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853328
