Title :
Packaging aspects of the LitebusTM parallel optoelectronic module
Author :
Freitag, Ladd ; Kuczynski, Joseph ; Fortier, Paul ; Guindon, Francois ; Letourneau, Martial ; Chan, Benson ; Sherman, John ; Johnson, Glen ; Demangone, Drew ; Mentzer, Mark ; Naghski, David ; Trostle, Brian
Author_Institution :
IBM Corp., Rochester, MN, USA
Abstract :
The Litebus module is an optoelectronic transceiver and the key component in a parallel fiber optic data link. The module is designed to extend computer-to-computer communications to data rates and link distances beyond those achievable in copper at comparable cost. A transceiver configuration was selected to keep the module´s size compact (45 mm×32 mm× 9.8 mm) and to facilitate the integration of an IEC Class 1 laser safety strategy. The Litebus module consists of various packaging components and both CMOS and optoelectronic dies. It is designed to accept a single connector, having one receive and one transmit section, that is mounted on the end of a dual 12 channel fiber optic ribbon cable. Channel-to-channel spacing is 250 μm throughout and standard multimode fiber is used. The transmitter consists of a VCSEL (Vertical Cavity Surface Emitting Laser) source having a wavelength of 850 nm. The receiver consists of a transimpedance amplifier with integrated Metal-Semiconductor-Metal (MSM) detector. The module´s transmit and receive sections were designed to operate at data rates greater than 1.25 Gb/s (gigabits per second) per channel, yielding a maximum aggregate data rate in excess of 15 Gb/s. In one mode of operation, byte-wide data is simultaneously transmitted from and received by the module at 1.25 GB/s (gigabytes per second), with the four remaining channels on each side being assigned to user-defined overhead functions. The maximum cable length is 400 m in asynchronous mode and 200 m in synchronous mode
Keywords :
integrated optoelectronics; optical communication equipment; optical interconnections; packaging; transceivers; Litebus; computer-to-computer communication; optoelectronic transceiver; packaging; parallel fiber optic data link; parallel optoelectronic module; Copper; Costs; Fiber lasers; IEC standards; Optical fiber cables; Optical fibers; Packaging; Surface emitting lasers; Transceivers; Vertical cavity surface emitting lasers;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853335