• DocumentCode
    2171932
  • Title

    A study on placement of post silicon clock tuning buffers for mitigating impact of process variation

  • Author

    Nagaraj, Kelageri ; Kundu, Sandip

  • Author_Institution
    Univ. of Massachusetts, Amherst, MA
  • fYear
    2009
  • fDate
    20-24 April 2009
  • Firstpage
    292
  • Lastpage
    295
  • Abstract
    Optical shrink for process migration, manufacturing process variation, temperature and voltage changes lead to clock skew as well as path delay variations in a manufactured chip. Such variations end up degrading the performance of manufactured chips. Since, such variations are hard to predict in pre-silicon phase, tunable clock buffers have been used in several designs. These buffers are tuned to improve maximum operating clock frequency of a design. Previously, we have presented an algorithmic approach that uses delay measurements on a few selected patterns to determine which buffers should be targeted for tuning. In this paper, a study on impact of tunable buffer placement on performance is reported. Greatest benefit from tunable buffer placement is observed, when the clock tree is designed by the proposed tuning system assuming random delay perturbations during design. Accordingly, we present a clock tree synthesis procedure which offer very good protection against process variation as borne out by the results.
  • Keywords
    clocks; integrated circuit manufacture; integrated circuit reliability; semiconductor technology; clock tree synthesis; manufacturing process variation impact; maximum operating clock frequency; optical shrink; post silicon clock tuning buffer; process migration; tunable buffer placement; Clocks; Degradation; Delay; Frequency; Manufacturing processes; Optical buffering; Optical tuning; Silicon; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
  • Conference_Location
    Nice
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-4244-3781-8
  • Type

    conf

  • DOI
    10.1109/DATE.2009.5090674
  • Filename
    5090674