DocumentCode
2171944
Title
Realisation of a phased-array multi-wavelength laser using hybridly integrated PICs
Author
Thourhout, D. Van ; Van Hove, A. ; Van Caenegem, T. ; Vandeputte, K. ; Vandaele, P. ; Moerman, I. ; Leijtens, X. ; Smit, M.K. ; Baets, R.
Author_Institution
IMEC, Ghent Univ., Belgium
fYear
2000
fDate
2000
Firstpage
1266
Lastpage
1271
Abstract
We developed a hybrid integration technology only employing InP components and realised a multi-wavelength laser using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3-dB bandwidth and a linewidth below 1 MHz were measured
Keywords
III-V semiconductors; indium compounds; integrated optics; semiconductor laser arrays; 1.6 GHz; InP; InP component; UV curing; chip bonding; epoxy resin; hybrid integration technology; packaging; phased array multiwavelength laser; photonic integrated circuit; Indium phosphide; Multiplexing; Optical amplifiers; Optical arrays; Optical coupling; Optical devices; Optical transmitters; Optical waveguides; Stimulated emission; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853336
Filename
853336
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