DocumentCode
2172076
Title
UV Curing Effects on Glass Structure and Mechanical Properties of Organosilicate Low-k Thin Films
Author
Gage, David M. ; Guyer, Eric P. ; Stebbins, Jonathan F. ; Cui, Zhenjiang ; Al-Bayati, Amir ; Demos, Alex ; MacWilliams, Kenneth P. ; Dauskardt, Reinhold H.
Author_Institution
Dept. of Mater. Sci. & Eng., Stanford Univ., CA
fYear
2006
fDate
5-7 June 2006
Firstpage
149
Lastpage
151
Abstract
Ultra-violet radiation curing has emerged as a promising technique for enhancing the glass structure and mechanical properties of low-k organosilicate thin films. The present work examines the effects of UV curing on the adhesive and cohesive fracture properties of carbon-doped oxide low-k films. Detailed 29Si and 13C nuclear magnetic resonance spectroscopy was employed to study the effects of UV curing on glass structure. The UV curing process is demonstrated to improve the glass network by decreasing the number of terminal non-bridging bonds and increasing the number of cross-linking bonds, leading to significant increases in elastic modulus and interfacial fracture energy. However, an interesting finding is that UV curing does not lead to similar improvements in the films´ cohesive strength or their resistance to environmentally assisted cracking in chemical environments. Possible mechanisms responsible for this unexpected behavior are discussed
Keywords
NMR spectroscopy; carbon; curing; elastic moduli; fracture; glass structure; low-k dielectric thin films; organic compounds; silicon; SiC; UV curing effects; adhesive fracture properties; carbon-doped oxide low-k films; cohesive fracture properties; cross-linking bonds; elastic modulus; glass structure; interfacial fracture energy; mechanical properties; non-bridging bonds; nuclear magnetic resonance spectroscopy; organosilicate low-k thin films; Chemicals; Curing; Dielectric constant; Dielectric thin films; Glass; Magnetic films; Mechanical factors; Nuclear magnetic resonance; Spectroscopy; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2006 International
Conference_Location
Burlingame, CA
Print_ISBN
1-4244-0104-6
Type
conf
DOI
10.1109/IITC.2006.1648673
Filename
1648673
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