DocumentCode :
2172090
Title :
Progress in electronics packaging virtual laboratory development
Author :
Gordon, Péter ; Bojta, Péter ; Hertel, L. ; Kállai, István ; Lepsényi, Imre ; Varnai, L. ; Illyefalvi-Fitez, Z.
Author_Institution :
Dept. of Electron. Technol., Budapest Tech. Univ., Hungary
fYear :
2000
fDate :
2000
Firstpage :
1293
Lastpage :
1299
Abstract :
The development of information technology has opened new perspectives in electronics packaging education to prepare engineers for the needs of the 21st century. The Department of Electronics Technology has been working on the improvement of the education in this respect for many years. It has obtained an IEEE/NSF grant in 1999 to create the Virtual Laboratory, a solution of the educational support with the newest and high-quality Web-technology. This paper gives a summary of the results of the one-year long practical development
Keywords :
electronic engineering education; packaging; Internet; World Wide Web; electronic packaging education; information technology; virtual laboratory; Computer aided manufacturing; Computer integrated manufacturing; Educational technology; Electronics packaging; Integrated circuit technology; Laboratories; Microelectronics; Surface-mount technology; Thick films; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853342
Filename :
853342
Link To Document :
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