Title :
Novel Active Integrated Antenna Configuration using Multi-Layered Teflon Substrate and Solder Bump Interconnection for Large Scale Array
Author :
Seki, Tomohiro ; Cho, Keizo ; MIZUNO, Hideki
Author_Institution :
NTT Network Innovation Laboratories, NTT Corporation, 1-1 Hikari-no-oka, Yokosuka-shi, Kanagawa 239-0847, Japan. E-mail: t.seki@ieee.org
Abstract :
We propose a novel multi-layered connection method that uses a solder bump on a Teflon substrate. Furthermore, we present the characteristics of the through hole and pin-fed microstrip antenna that are necessary to establish the multi-layered substrate. A prototype antenna of the pin-fed active integrated antenna is presented.
Keywords :
Antenna arrays; Antenna feeds; Bonding; Coupling circuits; Frequency; Large scale integration; Microstrip antenna arrays; Microstrip antennas; Substrates; Transmitting antennas;
Conference_Titel :
Microwave Conference, 2002. 32nd European
Conference_Location :
Milan, Italy
DOI :
10.1109/EUMA.2002.339357
