A highly integrated T/R module for active phased array antennas

Author

Fujii, K. ; Hara, Y. ; Shibuya, Y. ; Sakai, T. ; Takano, Y.

Author_Institution

Japan Radio Co. Ltd., Tokyo, Japan

fYear

1998

fDate

11-8 June 1998

Firstpage

77

Lastpage

80

Abstract

A highly integrated transmit/receive (T/R) module that has achieved integration levels superior to any MMIC module is described. The highly integrated T/R module is achieved by using LTCC (Low Temperature Co-fired Ceramic) multiple layer substrate, highly integrated MMIC chip-set, large-signal simulation for switching MESFET circuits, high power and high efficiency amplifiers using a PHEMT process, multiple-cavity package, advanced thin-film substrate which enables to realize air bridge structures, and self align like void free MMIC die-bonding technique.

Keywords

MMIC; active antenna arrays; antenna accessories; antenna phased arrays; ceramics; hybrid integrated circuits; microassembling; microwave antenna arrays; microwave integrated circuits; modules; packaging; substrates; thin film circuits; LTCC multiple layer substrate; MMIC chip-set; MMIC die-bonding technique; PHEMT process; active phased array antennas; advanced thin-film substrate; air bridge structures; high power amplifiers; highly integrated T/R module; low temperature co-fired ceramic substrate; multiple-cavity package; self aligned die-bonding technique; switching MESFET circuits; transmit/receive module; Antenna arrays; Ceramics; Circuit simulation; High power amplifiers; MESFET circuits; MMICs; Phased arrays; Substrates; Switching circuits; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE

Conference_Location

Baltimore, MD, USA

ISSN

1097-2633

Print_ISBN

0-7803-4439-1

Type

conf

DOI

10.1109/RFIC.1998.682052

Filename

682052