Title :
0.1μm InGaAs/InAlAs/InP HEMT low noise amplifiers with compact stacked cascode design and its de-bias effect induced failure (DBIF)
Author :
Grundbacher, R. ; Chou, Y.C. ; Raja, R. ; Lai, R. ; Leung, D. ; Kan, Q. ; Schreyer, G. ; Zell, G. ; Eng, D. ; Liu, P.H. ; Block, T. ; Oki, A.
Author_Institution :
Northrop Grumman Space Technol., Redondo Beach, CA, USA
Abstract :
Compact Q-band low noise amplifier modules using 0.1 μm InGaAs/InAlAs/InP HEMT MMICs have been demonstrated with high performance and high manufacturability over a frequency band from 43.5 to 45.5 GHz at Northrop Grumman Space Technology (NGST). The compact InP HEMT LNAs and modules are essential for phased-array applications. The LNA modules demonstrate noise figure less than 2.5 dB over the frequency band of 43.5 to 45.5 GHz. The RF performance results achieved here, in conjunction with previously reported high reliability results, further demonstrate the readiness of NGST´s 0.1 μm InP HEMT MMIC technology for advanced phased-array applications. In addition, Ig de-bias effect induced failure (DBIF) was observed on InP HEMT MMICs with stacked cascode configuration subjected to elevated temperature lifetest. Accordingly, an acceptable lifetest temperature window was found to alleviate DBIF while performing lifetest on InP HEMT MMICs with stacked cascode configuration.
Keywords :
HEMT integrated circuits; MMIC amplifiers; aluminium compounds; gallium arsenide; indium compounds; integrated circuit noise; modules; 43.5 to 45.5 GHz; InGaAs-InAlAs-InP; InGaAs-InAlAs-InP HEMT low noise amplifiers; MMICs; RF performance; compact Q-band low noise amplifier modules; compact stacked cascode design; de-bias effect induced failure; frequency band; lifetest temperature window; noise figure; phased-array applications; Frequency; HEMTs; Indium compounds; Indium gallium arsenide; Indium phosphide; Low-noise amplifiers; MMICs; Manufacturing; Space technology; Temperature;
Conference_Titel :
Indium Phosphide and Related Materials, 2005. International Conference on
Print_ISBN :
0-7803-8891-7
DOI :
10.1109/ICIPRM.2005.1517451