• DocumentCode
    2172657
  • Title

    ADVANTOXTM more radiation-resistant than full dose SIMOX

  • Author

    Liu, S.T. ; Hughes, H. ; Jenkins, W. ; Allen, L.

  • Author_Institution
    Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA
  • fYear
    1997
  • fDate
    6-9 Oct 1997
  • Firstpage
    148
  • Lastpage
    149
  • Abstract
    Summary form only given. Silicon-On-Insulator (SOI) material has received significant attention due to its ability to provide high performance and power reduction advantages attributable to reduced parasitic substrate capacitance and total oxide isolation of CMOS devices. SOI CMOS technology is now being considered as one of the most promising candidates for high speed and low power digital ULSI circuit applications. We have been producing radiation hard SOI SRAMs and ASICs using full dose SIMOX for some time. We have observed that the incoming full dose SIMOX material needs to be screened for production due to particulates and background impurity. In a search for quality SOI wafers at lower cost for future radiation hard electronics applications, we have evaluated a new low dose SIMOX called ADVANTOXTM. This paper reports the total dose radiation response of ADVANTOXTM buried oxide, compares it to full dose SIMOX, and models the radiation response using a simple equation with two parameters
  • Keywords
    CMOS integrated circuits; SIMOX; buried layers; integrated circuit modelling; radiation effects; radiation hardening (electronics); ADVANTOX; SOI CMOS technology; Si; buried oxide; low dose SIMOX; quality SOI wafers; radiation hard electronics applications; radiation response modelling; total dose radiation response; CMOS digital integrated circuits; CMOS technology; Costs; Impurities; Isolation technology; Parasitic capacitance; Production; Semiconductor device modeling; Silicon on insulator technology; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1997. Proceedings., 1997 IEEE International
  • Conference_Location
    Fish Camp, CA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-3938-X
  • Type

    conf

  • DOI
    10.1109/SOI.1997.634976
  • Filename
    634976