DocumentCode
2172661
Title
HOT TOPIC - Concurrent SoC development and end-to-end planning
Author
Anghel, Lorena
Author_Institution
TIMA Laboratory, France
fYear
2009
fDate
20-24 April 2009
Firstpage
430
Lastpage
430
Abstract
SoC development requires interaction between a wide range of engineering disciplines. Each of which brings in optimisation factors that impacts other disciplines. Therefore, concurrent development and end-to-end planning between these disciplines are necessary. This session will show the overlap between design, packaging, silicon manufacturing, test and yield optimisation.
Keywords
Design optimization; Laboratories; Manufacturing; Packaging; Silicon; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
Conference_Location
Nice
ISSN
1530-1591
Print_ISBN
978-1-4244-3781-8
Type
conf
DOI
10.1109/DATE.2009.5090702
Filename
5090702
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