DocumentCode
2172679
Title
Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles
Author
Sato, Shintaro ; Nihei, Mizuhisa ; Mimura, Atsushi ; Kawabata, Akio ; Kondo, Daiyu ; Shioya, Hiroki ; Iwai, Taisuke ; Mishima, Miho ; Ohfuti, Mari ; Awano, Yuji
Author_Institution
Fujitsu Ltd., Atsugi
fYear
2006
fDate
5-7 June 2006
Firstpage
230
Lastpage
232
Abstract
We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Omega for 2-mum vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst
Keywords
carbon nanotubes; catalysts; integrated circuit interconnections; nanoparticles; 2 micron; 50 ohm; CNT-via resistance; carbon nanotube via interconnects; deposition system; nanoparticle catalyst; preformed catalyst nanoparticles; size-classified catalyst particles; size-controlled catalyst nanoparticles; via holes; Carbon nanotubes; Ceramics; Current density; Dielectric substrates; Electric resistance; Laboratories; Nanoparticles; Nanotechnology; Tin; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2006 International
Conference_Location
Burlingame, CA
Print_ISBN
1-4244-0104-6
Type
conf
DOI
10.1109/IITC.2006.1648696
Filename
1648696
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