• DocumentCode
    2172679
  • Title

    Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

  • Author

    Sato, Shintaro ; Nihei, Mizuhisa ; Mimura, Atsushi ; Kawabata, Akio ; Kondo, Daiyu ; Shioya, Hiroki ; Iwai, Taisuke ; Mishima, Miho ; Ohfuti, Mari ; Awano, Yuji

  • Author_Institution
    Fujitsu Ltd., Atsugi
  • fYear
    2006
  • fDate
    5-7 June 2006
  • Firstpage
    230
  • Lastpage
    232
  • Abstract
    We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Omega for 2-mum vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst
  • Keywords
    carbon nanotubes; catalysts; integrated circuit interconnections; nanoparticles; 2 micron; 50 ohm; CNT-via resistance; carbon nanotube via interconnects; deposition system; nanoparticle catalyst; preformed catalyst nanoparticles; size-classified catalyst particles; size-controlled catalyst nanoparticles; via holes; Carbon nanotubes; Ceramics; Current density; Dielectric substrates; Electric resistance; Laboratories; Nanoparticles; Nanotechnology; Tin; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2006 International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    1-4244-0104-6
  • Type

    conf

  • DOI
    10.1109/IITC.2006.1648696
  • Filename
    1648696