Title :
Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles
Author :
Sato, Shintaro ; Nihei, Mizuhisa ; Mimura, Atsushi ; Kawabata, Akio ; Kondo, Daiyu ; Shioya, Hiroki ; Iwai, Taisuke ; Mishima, Miho ; Ohfuti, Mari ; Awano, Yuji
Author_Institution :
Fujitsu Ltd., Atsugi
Abstract :
We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Omega for 2-mum vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst
Keywords :
carbon nanotubes; catalysts; integrated circuit interconnections; nanoparticles; 2 micron; 50 ohm; CNT-via resistance; carbon nanotube via interconnects; deposition system; nanoparticle catalyst; preformed catalyst nanoparticles; size-classified catalyst particles; size-controlled catalyst nanoparticles; via holes; Carbon nanotubes; Ceramics; Current density; Dielectric substrates; Electric resistance; Laboratories; Nanoparticles; Nanotechnology; Tin; Wiring;
Conference_Titel :
Interconnect Technology Conference, 2006 International
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-0104-6
DOI :
10.1109/IITC.2006.1648696