Advancing polymer process understanding in package and board applications through molecular modeling

In this paper we will discuss two molecular modeling methods which have been developed and applied at Honeywell to help predict material behavior from the process engineer´s standpoint. Both stress cycling and process analyses have been used to trend the probable behavior of material types in order to provide advanced intelligence on possible failure mechanisms. For instance, we have found that there are similarities in the response trends to strain and the number of cycles which suggests a link exists between the molecular-scale mechanism and engineering theories of reliability. That is, the cycling response on a molecular scale appears to be Coffin-Manson-like. On a similar scale, the molecular response of polymer chains to process stress induced either thermally or mechanically has shown to give insight to the response from actual processed parts