Recent MMW technology development and its military and commercial applications

Author

Lau, K.-F. ; Liu, L. ; Dow, S.

Author_Institution

TRW S&EG, Redondo Beach, CA, USA

fYear

1998

fDate

11-8 June 1998

Firstpage

87

Lastpage

90

Abstract

This paper highlights key recent advances in the infrastructure of Milli-Meter Wave (MMW) technology. They include improved MMIC design methodologies, enhanced HEMT and HBT wafer processes, new on-wafer testing capabilities, automated assembly of MMW Multi-Chip Assemblies (MCAs) and new packaging techniques. It also addresses the implications of these advances in terms of their impact on a wide range of military and commercial systems. The paper concludes with comments on future trends and directions of the MMW technology.

Keywords

MIMIC; integrated circuit technology; military equipment; millimetre wave integrated circuits; HBT wafer processing; HEMT wafer processing; MMIC design; MMW technology; automated assembly; commercial applications; military applications; millimeter wave technology; multi-chip assembly; on-wafer testing; packaging; Assembly; Circuits; Frequency; Gallium arsenide; HEMTs; Heterojunction bipolar transistors; Indium phosphide; MMICs; Packaging; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE

Conference_Location

Baltimore, MD, USA

ISSN

1097-2633

Print_ISBN

0-7803-4439-1

Type

conf

DOI

10.1109/RFIC.1998.682054

Filename

682054