Title :
Recent MMW technology development and its military and commercial applications
Author :
Lau, K.-F. ; Liu, L. ; Dow, S.
Author_Institution :
TRW S&EG, Redondo Beach, CA, USA
Abstract :
This paper highlights key recent advances in the infrastructure of Milli-Meter Wave (MMW) technology. They include improved MMIC design methodologies, enhanced HEMT and HBT wafer processes, new on-wafer testing capabilities, automated assembly of MMW Multi-Chip Assemblies (MCAs) and new packaging techniques. It also addresses the implications of these advances in terms of their impact on a wide range of military and commercial systems. The paper concludes with comments on future trends and directions of the MMW technology.
Keywords :
MIMIC; integrated circuit technology; military equipment; millimetre wave integrated circuits; HBT wafer processing; HEMT wafer processing; MMIC design; MMW technology; automated assembly; commercial applications; military applications; millimeter wave technology; multi-chip assembly; on-wafer testing; packaging; Assembly; Circuits; Frequency; Gallium arsenide; HEMTs; Heterojunction bipolar transistors; Indium phosphide; MMICs; Packaging; Testing;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4439-1
DOI :
10.1109/RFIC.1998.682054
