• DocumentCode
    2173103
  • Title

    Investigation on Intelligent Packaging and Conductive Ink

  • Author

    Li, Lu-Hai ; Fang, Yi ; Xin, Zhi-Qing ; Tang, Xiao-Jun ; Zhao, Wen ; Du, Peng ; Mo, Li-Xin

  • Author_Institution
    Beijing Area Key Lab. of Printing & Packaging Mater. & Technol., Beijing Inst. of Graphic Commun., Beijing, China
  • fYear
    2009
  • fDate
    17-19 Oct. 2009
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    There are three kinds of packaging included in intelligent packaging. The conductive ink is important in the intelligent packaging. It can be used in the printing antenna of Radio Frequency Identification (RFID) and so on. The PEDT complex with polystyrene sulfuric acid (PEDT: PSS) plays an important commercial role in antistatic and conductive coatings, electronic components and displays. The organic conductive ink was investigated by adding a series of addictive such as DMF (dimethylformamide), DMSO (Dimethyl sulfoxide), and ammonia. And the offset printing performance was tested. The testing result tells us that all DMF and DMSO will improve the conductivity of printed sample on coating paper or PET film in some fraction, especially when the fraction of less than 5% (V/V). By the aging test on the proof, it was found that temperature, moisture and the other environment conditions effect on the proof conductivity too. All above give you a valuable reference in the making and application of conductive ink.
  • Keywords
    conducting polymers; ink; packaging; polymer films; printing; PEDT complex; PET film; RFID; ammonia; antenna printing; dimethyl sulfoxide; dimethylformamide; intelligent packaging; offset printing performance; organic conductive ink; polystyrene sulfuric acid; radio frequency identification; Coatings; Conductivity; Displays; Electronic components; Electronics packaging; Ink; Positron emission tomography; Printing; Radiofrequency identification; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Engineering and Informatics, 2009. BMEI '09. 2nd International Conference on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-1-4244-4132-7
  • Electronic_ISBN
    978-1-4244-4134-1
  • Type

    conf

  • DOI
    10.1109/BMEI.2009.5304748
  • Filename
    5304748