Title :
Transient analysis of bridge microhotplate
Author :
Saxena, Gaurav ; Paily, Roy
Author_Institution :
Dept. of Electron. & Electr. Eng., Indian Inst. of Technol. Guwahati, Guwahati, India
Abstract :
For the transient analysis of bridge membrane, a lumped element model is developed. The developed model is employed for analyzing the effect of increased thermal mass on the thermal time response and steady state power consumption. The model is compared with the FEM simulation results and is in close agreement, with a maximum error of 3.2% and 8% in transient response and power calculations respectively. With 8 μm thick nitride layer, the time constant has increased by 72.95%.
Keywords :
electric heating; micromechanical devices; transient analysis; bridge membrane; bridge microhotplate; lumped element model; steady state power consumption; thermal mass; thermal time response; transient analysis; Bridge circuits; Capacitance; Insulation; Steady-state; Thermal resistance; Transient analysis; Bridge membrane; lumped element model; microhotplate; steady state power consumption; transient analysis;
Conference_Titel :
Advanced Electronic Systems (ICAES), 2013 International Conference on
Conference_Location :
Pilani
Print_ISBN :
978-1-4799-1439-5
DOI :
10.1109/ICAES.2013.6659422
