DocumentCode
2173774
Title
Low profile package technology for IrDA compliant transceivers
Author
Nitsche, Volker
Author_Institution
Vishay Semicond. GmbH, Heilbronn, Germany
fYear
2000
fDate
2000
Firstpage
1489
Lastpage
1492
Abstract
Vishay Semiconductor GmbH is one of the major suppliers for infrared wireless communication devices, i.e. IrDA compliant transceivers. Devices aimed for the telecommunication market ask for increasingly smaller package outlines with high quality and ever lower power consumption. Two basically different technologies are now on the market: packages based on a leadframe technology and substrate technology (molded PCB). Vishay favors the leadframe and the quest for a small outline package lead to the development of a package utilizing a Chip-on-Chip solution (CoC)
Keywords
optical communication equipment; packaging; transceivers; Chip-on-Chip small outline package; IrDA compliant transceiver; infrared wireless communication device; leadframe technology; Application specific integrated circuits; Bonding; Communication cables; Energy consumption; Integrated circuit packaging; Lenses; Printers; Semiconductor device packaging; Transceivers; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853410
Filename
853410
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