• DocumentCode
    2173774
  • Title

    Low profile package technology for IrDA compliant transceivers

  • Author

    Nitsche, Volker

  • Author_Institution
    Vishay Semicond. GmbH, Heilbronn, Germany
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1489
  • Lastpage
    1492
  • Abstract
    Vishay Semiconductor GmbH is one of the major suppliers for infrared wireless communication devices, i.e. IrDA compliant transceivers. Devices aimed for the telecommunication market ask for increasingly smaller package outlines with high quality and ever lower power consumption. Two basically different technologies are now on the market: packages based on a leadframe technology and substrate technology (molded PCB). Vishay favors the leadframe and the quest for a small outline package lead to the development of a package utilizing a Chip-on-Chip solution (CoC)
  • Keywords
    optical communication equipment; packaging; transceivers; Chip-on-Chip small outline package; IrDA compliant transceiver; infrared wireless communication device; leadframe technology; Application specific integrated circuits; Bonding; Communication cables; Energy consumption; Integrated circuit packaging; Lenses; Printers; Semiconductor device packaging; Transceivers; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853410
  • Filename
    853410