DocumentCode :
2173774
Title :
Low profile package technology for IrDA compliant transceivers
Author :
Nitsche, Volker
Author_Institution :
Vishay Semicond. GmbH, Heilbronn, Germany
fYear :
2000
fDate :
2000
Firstpage :
1489
Lastpage :
1492
Abstract :
Vishay Semiconductor GmbH is one of the major suppliers for infrared wireless communication devices, i.e. IrDA compliant transceivers. Devices aimed for the telecommunication market ask for increasingly smaller package outlines with high quality and ever lower power consumption. Two basically different technologies are now on the market: packages based on a leadframe technology and substrate technology (molded PCB). Vishay favors the leadframe and the quest for a small outline package lead to the development of a package utilizing a Chip-on-Chip solution (CoC)
Keywords :
optical communication equipment; packaging; transceivers; Chip-on-Chip small outline package; IrDA compliant transceiver; infrared wireless communication device; leadframe technology; Application specific integrated circuits; Bonding; Communication cables; Energy consumption; Integrated circuit packaging; Lenses; Printers; Semiconductor device packaging; Transceivers; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853410
Filename :
853410
Link To Document :
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