DocumentCode :
2173789
Title :
Measurement and simulation of self-heating in SOI CMOS analogue circuits
Author :
Tenbroek, B.M. ; Lee, M.S.L. ; Redman-White, W. ; Edwards, C.F. ; Bunyan, R.J.T. ; Uren, M.J.
Author_Institution :
Dept. of Electron. & Comput. Sci., Southampton Univ., UK
fYear :
1997
fDate :
6-9 Oct 1997
Firstpage :
156
Lastpage :
157
Abstract :
Summary form only given. The influence of dynamic self-heating on SOI MOSFET device behaviour is becoming well known. Although digital circuits typically operate sufficiently fast that self-heating does not affect behaviour, its effects must still be considered during parameter extraction. However, that the operation of analogue circuits will be influenced by self-heating is much more likely. Consequently, SPICE models should include self-heating, with accurately characterised thermal resistances and time constants. This paper explores the effect of self-heating on some common analogue circuits in a 0.7 μm PD SOI technology, both from measurements and from SPICE simulations using a new SOI MOSFET model (STAG v2.0)
Keywords :
CMOS analogue integrated circuits; circuit analysis computing; integrated circuit measurement; integrated circuit modelling; silicon-on-insulator; thermal analysis; thermal resistance; 0.7 micron; SOI CMOS analogue circuits; SOI MOSFET device behaviour; SOI MOSFET model; SPICE models; STAG v2.0; Si; dynamic self-heating; partially-depleted SOI technology; thermal resistances; time constants; CMOS analog integrated circuits; Circuit simulation; Delay; Earth; MOSFET circuits; Predictive models; Ring oscillators; SPICE; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1997. Proceedings., 1997 IEEE International
Conference_Location :
Fish Camp, CA
ISSN :
1078-621X
Print_ISBN :
0-7803-3938-X
Type :
conf
DOI :
10.1109/SOI.1997.634980
Filename :
634980
Link To Document :
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