Modeling and simulation of the dynamic response of the electronic packaging

Nonlinear laminate theory is applied for the printed wiring board dynamic response modeling and analysis. Equations of motion for the isotropic laminates are derived for free and forced vibration response analysis of the simply supported printed wiring board. The forced oscillation can be caused by the constant impact loading or periodic harmonic loading. Analytical solutions are given to certain loading conditions. Comparisons are made between the response of linear and nonlinear systems in terms of deflection simulation generated from numerical solutions. Results show that a nonlinear system has higher frequency oscillations and lower magnitude than that of the linear system. Nonlinear theory gives more reasonable results for large amplitude deflection under heavy load than that of the linear theory. The theoretical approach in a laminated configuration provides the ability for modal analyses, laminate stresses and interfacial stress analyses of the printed wiring board for reliability studies