DocumentCode :
2174086
Title :
InGaAs/InAlAs quantum wells on wafer bonded InP/GaAs substrates
Author :
Hayashi, S. ; Sandhu, R. ; Chen, G. ; Hicks, R. ; Goorsky, M.S.
Author_Institution :
Dept. of Mater. Sci. & Eng., California Univ., Los Angeles, CA, USA
fYear :
2005
fDate :
8-12 May 2005
Firstpage :
389
Lastpage :
391
Abstract :
Metalorganic vapor phase epitaxial growth of InGaAs/InAlAs quantum well structures on wafer bonded and exfoliated InP films on GaAs substrates were assessed. The composite substrates were fabricated using silicon nitride intermediate layers and through hydrogen-implant induced exfoliation of an InP layer. The InP layer was subjected to a chemical mechanical polish step to produce an epi-ready sub-nm surface roughness prior to the epitaxial growth. Photoluminescence, x-ray rocking curve, and transmission electron microscopy results from the heterostructures grown on the InP/GaAs template wafers were comparable to measurements from structures grown on standard InP substrates, demonstrating that this type of composite substrate can withstand high temperature epitaxial growth processes.
Keywords :
III-V semiconductors; MOCVD; aluminium compounds; chemical mechanical polishing; gallium arsenide; indium compounds; photoluminescence; semiconductor quantum wells; surface roughness; transmission electron microscopy; vapour phase epitaxial growth; InGaAs-InAlAs; InGaAs-InAlAs quantum well; InP-GaAs; X-ray rocking curve; chemical mechanical polish; heterostructure; hydrogen-implant induced exfoliation; metalorganic vapor phase epitaxial growth; photoluminescence; silicon nitride intermediate layer; surface roughness; transmission electron microscopy; wafer bonded InP-GaAs composite substrate; Chemicals; Epitaxial growth; Gallium arsenide; Indium compounds; Indium gallium arsenide; Indium phosphide; Rough surfaces; Silicon; Substrates; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 2005. International Conference on
ISSN :
1092-8669
Print_ISBN :
0-7803-8891-7
Type :
conf
DOI :
10.1109/ICIPRM.2005.1517509
Filename :
1517509
Link To Document :
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