Title :
Applications of newly developed positive photosensitive block co-polyimides to CSPs
Author :
Matsumoto, Shunichi ; Jin, Xing Zhou ; Fukushima, Takahumi ; Uemura, Takayuki ; Itatani, Hirosi
Author_Institution :
PI R&D Co. Ltd., Yokohama, Japan
Abstract :
Meeting the challenging market-defined needs of CSPs (chip sized packages) industry requires a new substrate technology that provides higher I/O densities, higher performance, thinner and lighter packaging structures than previously available solutions. In this paper, the first applications to CSP interposer (CSP-IP) processes by newly developed positive photosensitive block co-polyimides (PPI), which P I R&D Co., Ltd. of Japan has commercialized recently, are discussed
Keywords :
chip scale packaging; photoresists; polymer blends; polymer films; substrates; PPI film; chip sized package; interposer process; positive photosensitive block co-polyimide; substrate technology; Chip scale packaging; Costs; Polyimides; Polymers; Postal services; Production; Research and development; Solvents; Temperature; Workability;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853431
