Title :
Novel die attach films having high reliability performance for lead-free solder and CSP
Author :
Takeda, Shinji ; Masuko, Takashi
Author_Institution :
Hitachi Chem. Co. Ltd., Ibaraki, Japan
Abstract :
Properties and reliability of two kinds of die attach films were studied. A die attach film DF-335-7 developed for high temperature reflow soldering due to a lead(Pb)-free solder, was composed of a modified polyimide base resin, a thermosetting resin, and a silver filler. Relationships among peel strength, work of adhesion, water absorption, package crack resistance, and composition of the film were discussed. Another die attach film DF-400 for new advanced packages such as a Fine-pitch Ball Grid Array (F-BGA) and a Chip Scale Package (CSP) was studied. Relationships among chip warpage, attaching temperature, glass transition temperature (Tg) of a base resin, and package crack resistance were discussed
Keywords :
adhesion; ball grid arrays; chip scale packaging; environmental factors; filled polymers; fine-pitch technology; microassembling; reflow soldering; DF-335-7; DF-400; chip scale package; crack resistance; die attach film; fine-pitch ball grid array; glass transition temperature; lead-free solder; peel strength; polyimide base resin; reflow soldering; reliability; silver filler; thermosetting resin; water absorption; work of adhesion; Absorption; Adhesives; Chip scale packaging; Lead; Microassembly; Polyimides; Reflow soldering; Resins; Silver; Temperature;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853432
