Novel die attach films having high reliability performance for lead-free solder and CSP

Author

Takeda, Shinji ; Masuko, Takashi

Author_Institution

Hitachi Chem. Co. Ltd., Ibaraki, Japan

fYear

2000

fDate

2000

Firstpage

1616

Lastpage

1622

Abstract

Properties and reliability of two kinds of die attach films were studied. A die attach film DF-335-7 developed for high temperature reflow soldering due to a lead(Pb)-free solder, was composed of a modified polyimide base resin, a thermosetting resin, and a silver filler. Relationships among peel strength, work of adhesion, water absorption, package crack resistance, and composition of the film were discussed. Another die attach film DF-400 for new advanced packages such as a Fine-pitch Ball Grid Array (F-BGA) and a Chip Scale Package (CSP) was studied. Relationships among chip warpage, attaching temperature, glass transition temperature (Tg) of a base resin, and package crack resistance were discussed

Keywords

adhesion; ball grid arrays; chip scale packaging; environmental factors; filled polymers; fine-pitch technology; microassembling; reflow soldering; DF-335-7; DF-400; chip scale package; crack resistance; die attach film; fine-pitch ball grid array; glass transition temperature; lead-free solder; peel strength; polyimide base resin; reflow soldering; reliability; silver filler; thermosetting resin; water absorption; work of adhesion; Absorption; Adhesives; Chip scale packaging; Lead; Microassembly; Polyimides; Reflow soldering; Resins; Silver; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-5908-9

Type

conf

DOI

10.1109/ECTC.2000.853432

Filename

853432