DocumentCode :
2174442
Title :
Modeling of Inverted Coupled Microstrip Lines Fabricated using MEMS Technology
Author :
Richardson, A. ; Martoglio, L. ; Cirio, L. ; Richalot, E. ; Lissorgues-Bazin, G. ; Picon, O.
Author_Institution :
Université de Marne-la-Vallée, Bâtiment Copernic, rue Galilée, 77454 Marne-la-vallée-France
fYear :
2002
fDate :
23-26 Sept. 2002
Firstpage :
1
Lastpage :
4
Abstract :
3D electromagnetic simulations of a new low loss and low cost microstrip MEMS technology are presented in order to design passive components. First, the experimental validation of these simulation methods is presented. Then, electrical parameters and coupling coefficient are calculated for the inverted coupled lines on glass and on silicon. The characteristics of the two types of lines are finally compared.
Keywords :
Attenuation; Costs; Electromagnetic fields; Finite difference methods; Glass; Micromechanical devices; Microstrip components; Radio frequency; Silicon; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2002. 32nd European
Conference_Location :
Milan, Italy
Type :
conf
DOI :
10.1109/EUMA.2002.339432
Filename :
4140512
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2174442
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