Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

Author

Kazim, M.I. ; Herben, M.H.A.J.

Author_Institution

Dept. of Electr. Eng., Eindhoven Univ. of Technol. (TU/e), Eindhoven, Netherlands

fYear

2012

fDate

26-30 March 2012

Firstpage

878

Lastpage

882

Abstract

A systematic approach based on `package-peeling´ together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.

Keywords

antenna feeds; flip-chip devices; integrated circuit interconnections; microstrip antennas; millimetre wave antennas; millimetre wave measurement; millimetre wave power amplifiers; time-domain reflectometry; ACA flip-chip interconnection scheme; BFACP antenna; EM tool-based TDR; EM tool-based time-domain reflectometry; TDR measurement system; anisotropic conductive adhesive flip-chip interconnection scheme; balanced-fed-aperture- coupled-patch antenna; flip-chipped package analysis; frequency 60 GHz; millimeter-wave flip-chipped packages; package-peeling; power amplifier; Dielectric losses; Gain; Impedance; Loss measurement; Propagation losses; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (EUCAP), 2012 6th European Conference on

Conference_Location

Prague

Print_ISBN

978-1-4577-0918-0

Electronic_ISBN

978-1-4577-0919-7

Type

conf

DOI

10.1109/EuCAP.2012.6205869

Filename

6205869