• DocumentCode
    2175001
  • Title

    The effect of TiB2 addition on the thermoelectric properties of B4C ceramics

  • Author

    Cai, Ke-feng ; Nan, Ce Wen

  • Author_Institution
    Adv. Mater. Res. Inst., Wuhan Univ. of Technol., China
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    270
  • Lastpage
    273
  • Abstract
    B4C-TiB2 composites were prepared via hot-pressing. The thermal conductivity, electrical conductivity and Seebeck coefficient of samples containing 0, 12, 16, 20 vol% TiB2 are measured from room temperature up to 1200 K. The results show that the electrical conductivity and thermal conductivity increase with TiB2 content and that the Seebeck coefficient decreases with TiB2 content. The value of dimensionless figure of merit of 12% TiB2 sample is always higher than that of 0% TiB2 sample in the whole temperature range, and that of 16% TiB2 samples is also higher than that of 0% TiB2 sample as T<700 K and similar as T>700K, while that of 20% TiB2 samples is lower than that of 0% TiB2 sample due to its higher thermal conductivities and lower Seebeck coefficients than those of 0% TiB2 sample. These results indicate that it is possible to improve the thermoelectric properties of pure materials by selecting an optimum combination of different materials
  • Keywords
    Seebeck effect; boron compounds; ceramics; composite materials; electrical conductivity; hot pressing; thermal conductivity; titanium compounds; 293 to 1200 K; B4C-TiB2; Seebeck coefficient; TiB2 content; ceramics; composites; dimensionless figure of merit; electrical conductivity; hot-pressing; thermal conductivity; Ceramics; Composite materials; Conducting materials; Conductivity measurement; Microstructure; Nanostructured materials; Tellurium; Temperature measurement; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979885
  • Filename
    979885