• DocumentCode
    2175477
  • Title

    Partitioning Granularity, Communication Overhead, and Adaptation in OS Services for Distributed Reconfigurable Systems on Chip

  • Author

    Samara, Sufyan

  • Author_Institution
    Design of Distrib. Embedded Syst., Univ. of Paderborn, Paderborn, Germany
  • fYear
    2010
  • fDate
    11-13 Dec. 2010
  • Firstpage
    119
  • Lastpage
    126
  • Abstract
    Distributed embedded systems are exposed to variable applications and requirements. This results in a dynamic and unpredictable changes in the availability of resources. Existing operating system implementations for embedded devices are struggling to address the challenges of efficiently utilizing modern target platforms with heterogeneous computational elements and variable resources. To cope with these challenges, operating system services can be partitioned into small blocks that can run on any computational element and use different resource combinations in the target platform. Although this partitioning allows flexibility and adaptation, it also introduces undesired inter-partition communication overhead. In this paper we discuss a lower bound for the partitioning granularity in order to provide a trade off between communication overhead and adaptation. In addition, we argue the usage of pipelining as an approach to reducing the communication overhead. As a proof of concept a case study is presented.
  • Keywords
    distributed processing; embedded systems; operating systems (computers); system-on-chip; OS service; distributed embedded system; distributed reconfigurable systems on chip; embedded device; interpartition communication overhead; operating system service; partitioning granularity; Computer architecture; Embedded systems; Field programmable gate arrays; Hardware; Middleware; Pipeline processing; OS service; SoC; adaptable; distributed; operating system; partitioning granularity; pipelining; reconfigurable;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Science and Engineering (CSE), 2010 IEEE 13th International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-9591-7
  • Electronic_ISBN
    978-0-7695-4323-9
  • Type

    conf

  • DOI
    10.1109/CSE.2010.23
  • Filename
    5692465