Title :
Field results demonstrate reliability gains through improved cooling
Author_Institution :
McDonnell Douglas Aerosp., USA
Abstract :
The principle that improved cooling enhances the reliability of electronic equipment has long been accepted. Recently, questions have been raised concerning improved cooling and the expected magnitude of reliability gains. A recently completed analyses of operational results, comparing avionic reliability achieved on F-15 aircraft under significantly different cooling conditions, shows cooling-related reliability gains that exceeded predictions. The study was conducted by MDA F-15 engineering personnel under a contract awarded by the Air Force (WR-ALC/LFEFF). F-15E aircraft are equipped with an ECS package that produces 40°F inlet temperatures for forced air cooled equipment. Heat loads and flow rates are such that average equipment exhaust temperatures are 115°F. The corresponding temperatures created by the ECS package in the F-15C/D aircraft are 85°F and 124°F, respectively, resulting in mean equipment temperatures that are 27°F higher than experienced on the F-15E aircraft. Seventeen forced air cooled electronic Line Removable Units (LRUs), common to both the F-15E and F-15C/D aircraft were selected for a performance comparison. Reliability performance was measured using Mean Time Between Maintenance-Type 1 (MTBM-1) in Flight Hours, as reported by Air force field data systems. The data from several bases cover a one year period. The F-15E equipment, which benefits from improved cooling, showed an aggregate MTBM-1 that was forty four percent (44%) better than that achieved by the F-15C/D equipment. These measured results, attributable to better cooling, met or exceeded predicted improvements in reliability
Keywords :
Aerospace electronics; Aerospace engineering; Aircraft propulsion; Electronic equipment; Electronics cooling; Force measurement; Military aircraft; Packaging machines; Reliability engineering; Temperature;
Conference_Titel :
Aerospace and Electronics Conference, 1994. NAECON 1994., Proceedings of the IEEE 1994 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-1893-5
DOI :
10.1109/NAECON.1994.332879