Title :
Analysis and performance of BGA interconnects for RF packaging
Author :
Staiculescu, D. ; Pham, A. ; Laskar, J. ; Consolazio, S. ; Moghe, S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present the development of a lumped element model for the BGA transition using both measurements and simulations results. Measurements of the test structure are used to generate a circuit model for a single bump configuration. This model is used to calibrate EM simulations of the bump geometry. Furthermore, the effect of the bump diameter on the equivalent circuit model is presented. This model approach is scaleable and extendible to a more global behavior of BGA interconnects for RF packaging.
Keywords :
S-parameters; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; BGA interconnects; EM simulations; RF packaging; bump diameter; bump geometry; circuit model; lumped element model; single bump configuration; Circuit simulation; Circuit testing; Coplanar waveguides; Equivalent circuits; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Performance analysis; Radio frequency; Solid modeling;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4439-1
DOI :
10.1109/RFIC.1998.682064
