Analysis and performance of BGA interconnects for RF packaging

Author

Staiculescu, D. ; Pham, A. ; Laskar, J. ; Consolazio, S. ; Moghe, S.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

11-8 June 1998

Firstpage

131

Lastpage

134

Abstract

We present the development of a lumped element model for the BGA transition using both measurements and simulations results. Measurements of the test structure are used to generate a circuit model for a single bump configuration. This model is used to calibrate EM simulations of the bump geometry. Furthermore, the effect of the bump diameter on the equivalent circuit model is presented. This model approach is scaleable and extendible to a more global behavior of BGA interconnects for RF packaging.

Keywords

S-parameters; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; BGA interconnects; EM simulations; RF packaging; bump diameter; bump geometry; circuit model; lumped element model; single bump configuration; Circuit simulation; Circuit testing; Coplanar waveguides; Equivalent circuits; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Performance analysis; Radio frequency; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE

Conference_Location

Baltimore, MD, USA

ISSN

1097-2633

Print_ISBN

0-7803-4439-1

Type

conf

DOI

10.1109/RFIC.1998.682064

Filename

682064