DocumentCode :
2175797
Title :
[Front cover]
fYear :
2008
fDate :
10-12 Dec. 2008
Abstract :
Presents the front cover or splash screen of the proceedings.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Type :
conf
DOI :
10.1109/EDAPS.2008.4735976
Filename :
4735976
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2175797
