Thermoelectric micro modules for spot cooling of high density heat sources

Author

Semenyuk, V.

Author_Institution

Thermion Co., Odessa, Ukraine

fYear

2001

fDate

2001

Firstpage

391

Lastpage

396

Abstract

The paper represents further progress in the development of short-legged thermoelectric (TE) micro modules for cooling high power density electronic components. Theoretical analysis and experimental study are conducted to define an available temperature lowering and maximum heat flux densities for short-legged coolers with different kinds of substrates. Temperature differences exceeding 70 K are obtained with TE leg lengths down to 0.2 mm. A new series of micro modules with TE legs 0.2 and 0.3 mm long is developed with an aluminum nitride ceramic

Keywords

aluminium compounds; ceramic packaging; cooling; power electronics; thermal management (packaging); thermoelectricity; 0.2 mm; 0.3 mm; AlN; TE leg lengths; TE micro modules; aluminum nitride ceramic; cooler substrates; cooling; high density heat sources; high power density electronic components; maximum heat flux density; short-legged coolers; short-legged thermoelectric micro modules; spot cooling; temperature differences; temperature lowering; thermoelectric micro modules; Aluminum nitride; Ceramics; Contact resistance; Electronics cooling; Leg; Substrates; Tellurium; Temperature; Thermal resistance; Thermoelectricity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on

Conference_Location

Beijing

ISSN

1094-2734

Print_ISBN

0-7803-7205-0

Type

conf

DOI

10.1109/ICT.2001.979914

Filename

979914